01 Rewiring Layer (RDL)

     After fabricating high-density RDL lines on fan-out packages (FOWLP) or silicon/glass/organic interposers, photoresist residues on the sidewalls and bottom of the lines can easily cause short circuits or high-resistance faults.      After the plating/metallization of the RDL line is formed, residual substances in the through holes can be removed by plasma to avoid residual colloid causing short circuits or abnormal contact impedance of the metal line, and improve the quality of subsequent plating.

02 Glass through-hole TGV      Through glass vias (TGV) are the core vertical interconnection channels of the 2.5D/3D stack. The removal of photoresist in the vias faces high aspect ratio challenges.      Plasma can effectively remove photoresist residues in the via holes, ensuring reliability and avoiding the risk of microcracks that may be caused by traditional wet degluing.

03 Flip Chip      In the flip chip (FC) process, dry plasma de-bonding can remove residual photoresist on the surface and gaps of UBM to avoid causing solder joint interface failure (virtual solder/voids).

SINDIN plasma deglue machine is widely used in key processes such as surface deglue, activation and surface treatment in high-tech fields such as semiconductor manufacturing, MEMS devices, optoelectronic components, and advanced packaging.