Product features:

Infrared halogen lamp tube heating, cooling using air cooling;

PID temperature control with lamp power can accurately control temperature rise, ensuring good reproducibility and temperature uniformity;

Adopting a parallel gas inlet method, the gas inlet is set on the surface of the WAFER to avoid cold spots during annealing and ensure good temperature uniformity of the product;

Both atmospheric and vacuum treatment methods can be selected, with gas purification treatment before intake;

Two sets of process gases are standard;

Introduction:

For semiconductor chip bonding pre-treatment, plastic sealing pre-treatment, photoresist removal, metal bonding and pre-treatment.

Eight major advantages:

Plasma is not charged and will not cause damage to the circuit. During the processing, maintain a lower temperature

Fast reaction speed, short reaction time, no electrode, no pollution source, long service life

Can maintain plasma under high pressure, microwave junction and magnetic circuit are compatible

Self bias voltage requires low to high voltage sources and generators to be isolated from each other for safety

Introduction:

Can remove photoresist in BAW/SAW process, equipped with two types of single cavity and double cavity

Core advantages:

The degree of plasma ionization and decomposition is relatively high

High reproducibility after plasma treatment

Can maintain plasma under high pressure

Separation of high-pressure source and ion generator

Introduction:

Military grade welding technology, strong sealing of vacuum chamber, high-density plasma source, uniform cleaning in all directions;

Suitable for processing materials with large areas and complex shapes, it can be paired with dual or multiple process gas control for stable and high-density plasma sources, ensuring uniform cleaning in all directions.Multiple pieces/batches of materials can be processed at once, with high processing efficiency. According to industry needs, vacuum plasma assembly line equipment can be customized to work fully automatically, reducing labor costs.

Introduction:

A fully functional and highly scalable contact angle measuring instrument.

Instrument construction：

The contact angle measuring instrument mainly consists of five parts: control system, injection system, three-axis moving sample stage video acquisition system, and analysis software. The equipment adopts the principle of optical projection.

Ultrasonic Dry Cleaner provides 8-16Kpa of clean gas to the ultrasonic generation chamber of the dust removal head through a blower. The gas generates ultrasonic waves through an ultrasonic generator, utilizing the energy and vibration of ultrasonic waves to overcome the adhesion force on the surface of the glass substrate. The dust particles detach from the surface of the glass substrate through three modes of movement (single or mixed): lifting, rolling, and sliding.